JP-105 Hot Melt Adhesive for Coiling Block

Product Description

Discover stable and controllable bonding performance with JP-105 Hot Melt Adhesive for coiling block applications, developed to support efficient paper processing and lamination operations. At Hujump, we provide reliable adhesive solutions to meet the needs of specialized industrial applications.

This product offers moderate adhesion and easy peel properties, ensuring secure bonding while allowing clean separation when required. It is suitable for paper roll and release paper applications, delivering smooth operation and consistent results.

Appearance : Translucent granular solid

Operating temperature (°C) : 150-180

Curing time (s) : 2-4

Features

• Moderate adhesion

• Easy peel

• No glue silk

• Suitable for paper roll and release paper back fitting

Applications & Recommended Use