JW-2061.03 Hot Melt Adhesive for the Pocket Spring
$1.00
Product Description
Discover efficient and reliable bonding performance with JW-2061.03 Hot Melt Adhesive for pocket spring applications, developed to support stable processing in mattress manufacturing. At Hujump, we provide dependable adhesive solutions to meet the needs of modern production lines.
This product offers fast curing speed and good heat resistance, ensuring strong and durable bonding performance for pocket spring assembly. It supports high-speed production while maintaining consistent adhesion and clean application results.
Appearance: Translucent granular solid
Operating temperature (°C) : 140-180
Curing time (s) : 3-5
Features
Economical type
Fast curing
Low odor
Good heat resistance
Good adhesion to various mattress materials (such as PK cotton, non-woven fabric, etc.)